Trade Shows and Conferences

• DesignCon 2013, Santa Clara, CA
  

  Simbeor is number one in performance/cost metric: Dr. Shlepnev's interview at DesignCon 2013
  

  Y. Shlepnev, Elements of decompositional electromagnetic analysis of interconnects, Ballroom H, 1:30 pm - 4:30 pm, Monday, January 28, 2013. The presentation is available in presentations section of our web site.
  Eric Bogatin, Don DeGroot, Paul G. Huray, Yuriy Shlepnev, Which one is better? Comparing Options to Describe Frequency Dependent Losses, Ballroom E, 11:05 am - 11:45 am, Wednesday, January 30, 2013. The paper is nominated for DesignCon 2013 best paper award and is available in publications section and presentation in presentations section.
• EPEPS 2012, Tempe, AZ
  Y. Shlepnev, Coupled 2D Telegrapher's Equations for PDN Analysis, 9 AM, Wednesday, October 24, 2012. Paper is available in publications section and presentation in presentations section.
• DesignCon 2012, Santa Clara, CA
  Y. Shlepnev, C. Nwachukwu, Practical methodology for analyzing the effect of conductor roughness on signal losses and dispersion in interconnects. 9:20 am - 10:00 am, Wednesday, February 1, Ballroom G, the paper is nominated for DesignCon 2012 best paper award and is available in publications section and presentation in presentations section.
• IBIS Summit, Yokohama, Japan, November 18, 2011
  Y. Shlepnev, Quality of S-parameter Models. Japanese version is available here.
• IEEE International Symposium on Electromagnetic Compatibility (EMC2011), Long Beach, CA
  Y. Shlepnev, C. Nwachukwu, Roughness characterization for interconnect analysis. - Proc. of the 2011 IEEE International Symposium on Electromagnetic Compatibility, Long Beach, CA, USA, August, 2011, p. 518-523. Paper is also available in publications section and presentation in technical presentations section.
• IEEE International Symposium on Electromagnetic Compatibility (EMC2011), Long Beach, CA
  Y. Shlepnev, S. McMorrow, Nickel characterization for interconnect analysis. - Proc. of the 2011 IEEE International Symposium on Electromagnetic Compatibility, Long Beach, CA, USA, August, 2011, p. 524-529. Paper is also available in publications section and presentation in technical presentations section.
• DesignCon2011 IBIS Summit, Santa Clara, CA
  Y. Shlepnev, Reflections on S-parameter Quality. 
• Simbeor Takes the Prize - Again: Dr. Shlepnev's interview at DesignCon 2011
  
• DesignCon 2011, Santa Clara, CA
  E. Bogatin, B. Kirk, M. Jenkins,Y. Shlepnev, M. Steinberger, How to Avoid Butchering S Parameters, Track TP-T3, Dr. Shlepnev's presentation is available in technical presentations section.
• DesignCon 2011, Santa Clara, CA
  J. Bell, S. McMorrow, M. Miller, A. P. Neves, Y. Shlepnev, Unified Methodology of 3D-EM/Channel Simulation/Robust Jitter Decomposition, Track 13 - WA1, paper is available in publications section and presentation in presentations section.
• DesignCon 2011, Santa Clara, CA
  D. Dunham, J. Lee, S. McMorrow, Y. Shlepnev, 2.4mm Design/Optimization with 50 GHz Material Characterization, Track 13 - WA4, paper is available in publications section and presentation in presentations section.
• DesignCon2010 IBIS Summit, Santa Clara, CA
  Y. Shlepnev, Quality Metrics for S-parameter Models. 
• DesignCon2010, Santa Clara, CA
  Y. Shlepnev, A. Neves, T. Dagostino, S. McMorrow, Practical Identification of Dispersive Dielectric Models with Generalized Modal S-parameters for Analysis of Interconnects in 6-100 Gb/s Applications, Track 12-WA2, 9:20am-10:00am, paper is available in publications section and presentation in presentations section. 
• DesignCon2010, Santa Clara, CA
  H. Barnes, Y. Shlepnev, J. Nadolny, T. Dagostino, S. McMorrow, Quality of High Frequency Measurements: Practical Examples, Theoretical Foundations, and Successful Techniques that Work Past the 40GHz Realm, tutorial TF-MP12, February 1, 2010, 9am - 12 pm , all presentations are available in the technical presentation section.
• DesignCon2009 IBIS Summit, Santa Clara, CA
  Y. O. Shlepnev, Primer of mixed-mode transformations in differential interconnects. 
• DesignCon2009, Santa Clara, CA
  Y. Shlepnev, A. Neves, T. Dagostino, S. McMorrow, Measurement-Assisted Electromagnetic Extraction of Interconnect Parameters on Low-Cost FR–4 boards for 6–20 Gbps Applications, Track 12-WA1, 8:30am-9:10am, the paper won DesignCon 2009 best paper award and is available in publications section and presentation is in presentations section.  
• DesignCon2008 IBIS Summit, Santa Clara, CA
  Y. O. Shlepnev, Building advanced transmission line and via-hole models for serial channels with 10 Gbps and higher data rates.