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Technical Presentations
- #2011_06: Y. Shlepnev, Quality of S-parameter models, 2011 IBIS Summit, Yokohama, November 18, 2011. Translation in Japaneese is available here.
- #2011_05: Y. Shlepnev, C. Nwachukwu, Roughness characterization for interconnect analysis. - 2011 IEEE International Symposium on Electromagnetic Compatibility, Long Beach, CA, USA, August 17, 2011. © 2011 Simberian Inc. & Isola Group USA
- #2011_04: Y. Shlepnev, S. McMorrow, Nickel characterization for interconnect analysis. - 2011 IEEE International Symposium on Electromagnetic Compatibility, Long Beach, CA, USA, August 17, 2011. © 2011 Simberian Inc. & Teraspeed Consulting Group
- #2011_04: Y. Shlepnev, Reflections on S-parameter Quality, DesignCon 2011 IBIS Summit, Santa Clara, February 3, 2011.
- #2011_03: D. Dunham, J. Lee, S. McMorrow, Y. Shlepnev, Design and Optimization of a Novel 2.4 mm Coaxial Field Replaceable Connector Suitable for 25 Gbps System and Material Characterization up to 50 GHz, DesignCon 2011, Santa Clara, February 2, 2011.
- #2011_01: Y. Shlepnev, How to Avoid Butchering S-parameters, DesignCon 2011, Santa Clara, February 1, 2011.
- #2010_03: Y. Shlepnev, Quality Metrics for S-parameter Models, DesignCon 2010 IBIS Summit, Santa Clara, February 4, 2010.
- #2010_02: Y. Shlepnev, A. Neves, T. Dagostino, S. McMorrow, Practical Identification of Dispersive Dielectric Models with Generalized Modal S-parameters for Analysis of Interconnects in 6-100 Gb/s Applications, DesignCon 2010, Santa Clara, February 3, 2010.
- #2010_01: H. Barnes, Y. Shlepnev, J. Nadolny, T. Dagostino, S. McMorrow, Quality of High Frequency Measurements: Practical Examples, Theoretical Foundations, and Successful Techniques that
Work Past the 40GHz Realm, Tutorial materials from DesignCon 2010, Santa Clara, February 1, 2010.
- #2009_02: Y. Shlepnev, Primer of mixed-mode transformations in differential interconnects, DesignCon 2009 IBIS Summit, Santa Clara, February 5, 2009.
- #2009_01: Y. Shlepnev, A. Neves, T. Dagostino, S. McMorrow, Measurement-Assisted Electromagnetic Extraction of Interconnect Parameters on Low-Cost FR-4 boards for 6-20 Gbps Applications, DesignCon 2009, Santa Clara, February 4, 2009.
- #2008_01: Y. Shlepnev, Building advanced transmission line and via-hole models for serial channels with 10 Gbps and higher data rates, DesignCon IBIS Summit, Santa Clara, February 7, 2008.
- #2007_02: Y. Shlepnev, Building advanced via-hole models for analysis of PCB interconnects, PCB Design Conference East, Durham NC, October 24, 2007.
- #2007_01: Y. Shlepnev, Broadband transmission line models for analysis of serial data channel interconnects, PCB Design Conference East, Durham NC, October 23, 2007.
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