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News >>
·January 14, Simbeor 2007 Update Release...
·October 25, Agreement with Cadence...
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Events >>
·Feb. 5-6, DesignCon...
·Feb. 7, IBIS Summit...
·Aug. 18-22, IEEE EMC...
Articles >>
App Notes >>

Presentations

  1. What Is New in Simbeor 2007 - January 14, 2008 Update Release
  2. Simbeor 2007 Electromagnetic Simulation Environment: Basic Concepts (training class materials), October 1, 2007
  3. Simbeor 2007: 3D Full-Wave Electromagnetic Simulator for Multilayered Circuits (software overview), September 17, 2007
  4. What Is New in Simbeor 2007 - August 31, 2007 Update Release
  5. Advanced modeling of PCB and Packaging Interconnects with Simbeor® Electromagnetic Solver, May 2007.
  6. Broadband 3D electromagnetic analysis of interconnects with Simbeor® 3DML solver, April 2007.
  7. Simbeor®: Electromagnetic Simulation Environment for Electronics Design Automation (overview), March 2007.

Technical Presentations

  1. Y.O. Shlepnev, "Building advanced transmission line and via-hole models for serial channels with 10 Gbps and higher data rates", - Presented at DesignCon IBIS Summit, Santa Clara, February 7, 2008.
    © 2008 Simberian Inc.
  2. Y. O. Shlepnev, "Building advanced via-hole models for analysis of PCB interconnects", Invited Presentation at PCB Design Conference East, Durham NC, October 24, 2007.
    © 2007 Simberian Inc.
  3. Y. O. Shlepnev, "Broadband transmission line models for analysis of serial data channel interconnects", - Invited Presentation at PCB Design Conference East, Durham NC, October 23, 2007.
    © 2007 Simberian Inc.
  4. Y.O. Shlepnev, "Polytope Trefftz finite elements for electromagnetics", - Invited presentation at Mathematics of Finite Elements and Applications Symposium (MAFELAP'2003), July 2003, Brunel University, London.
    © 2003 Y.O. Shlepnev
  5. Y.O. Shlepnev, Minimal boundary elements for electromagnetics. - Invited presentation at Progress in Electromagnetic Research Symposium (PIERS'2001), Osaka, Japan, 2001.
    © 2001 Y.O. Shlepnev
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