|
Simbeor Application Notes
Solution files generated to illustrate the notes are either in Simbeor Solutions directory after installation of Simbeor or available for download - see information at the last page of the notes.
- #2012_01: Y. Shlepnev, C. Nwachukwu, Practical methodology for analyzing the effect of conductor roughness on signal losses and dispersion in interconnects, DesignCon2012. Slides from the presentation are also available here.
- #2011_04: Material parameters identification with GMS-parameters in Simbeor 2011. Version in Japanese is available here.
- #2011_03: D. Dunham, J. Lee, S. McMorrow, Y. Shlepnev, 2.4mm Design/Optimization with 50 GHz Material Characterization, DesignCon2011. Slides from the presentation are also available here.
- #2011_02: J. Bell, S. McMorrow, M. Miller, A. P. Neves, Y. Shlepnev, Unified Methodology of 3D-EM/Channel Simulation/Robust Jitter Decomposition, DesignCon2011.
- #2011_01: Y. Shlepnev, Reflections on S-parameter Quality, DesignCon2011 IBIS Summit.
- #2010_04: Material Identification With
GMS-Parameters of Coupled Lines.
- #2010_03: Sensitivity of PCB Material Identification with GMS-Parameters to Variations in Test Fixtures.
- #2010_02: Reciprocity and symmetry of interconnects with AC coupling capacitors.
- #2010_01: Y. Shlepnev, A. Neves, T. Dagostino, S. McMorrow, Practical identification of dispersive dielectric models with generalized modal S-parameters for analysis of interconnects in 6-100 Gb/s applications. Slides from the presentation are also available here and all Simbeor solutions generated for the material extraction and validation experiments are available in the data base of Simbeor Examples.
- #2009_06: Benchmarking Simbeor 2008.01 with resonant micro-strip planar structures from PLRD-1 board.
- #2009_05: Designing localizable minimal-reflection via-holes for multi-gigabit interconnects.
- #2009_05i: Designing localizable minimal-reflection via-holes for multi-gigabit interconnects (presentation with additional illustrative material).
- #2009_04: Micro-strip line characteristic impedance and TDR.
- #2009_03: Y. Shlepnev, A. Neves, T. Dagostino, S. McMorrow, Measurement-Assisted Electromagnetic Extraction of Interconnect Parameters on Low-Cost FR-4 boards for 6-20 Gb/sec Applications - the award-winning paper from DesignCon2009. Slides from the presentation are also available here and all Simbeor solutions generated for the material extraction and validation experiments are available in the data base of Simbeor Examples.
- #2009_02: Primer of investigation of 90-degree, 45-degree and arched bends in differential line.
- #2009_01: Practical notes on mixed-mode transformations in differential interconnects (with experimental validation).
- #2008_06: Modeling frequency-dependent dielectric loss and dispersion for multi-gigabit data channels (with experimental validation).
- #2008_05: Minimal-reflection bends in micro-strip lines.
- #2008_04: Minimization of reflection from AC coupling capacitors.
- #2008_03: Electromagnetic analysis of spiral inductors with Simbeor 2008.
- #2008_02: Electromagnetic analysis of AC coupling capacitor mounting structures.
- #2008_01: Electromagnetic analysis of decoupling capacitor mounting structures.
- #2007_09: Effect of slots in reference planes on signal propagation in single and differential t-lines.
- #2007_08: Design of optimal differential via-holes for 6-plane board.
- #2007_07: Modeling differential via-holes without stitching vias.
- #2007_06: Effect of microstrip line width on losses per unit length.
- #2007_05: De-compositional analysis of a connector breakout with Simbeor and HyperLynx.
- #2007_04: Examples of broadband extraction of transmission line parameters with Simbeor.
- #2007_03: Comparison of S-parameters of 90-deg. with two 45-deg. bends in microstrip line.
- #2007_02: Modeling frequency-dependent conductor losses and dispersion in serial data channel interconnects.
- #2007_01: Analysis of via-hole cross-talk and reflection loss for a BGA break-out.
|
